March 6th, 2015 | Company News
Whitepaper – Sub-nm layer measurements using ASOPS and laser induced ultrasound
The measurement of thin film layer thickness in industries such as silicon wafer manufacture requires the highest accuracy, resolution and speed, all in a non-invasive, non-destructive method. Here we report on laser-induced ultrasound using two frequency offset high repetition rate lasers to study layer thickness to a sub-nm resolution. Read the whitepaper here.